Last edited by Felkree
Friday, July 17, 2020 | History

3 edition of Electronic Packaging Technology Conference 2000 found in the catalog.

Electronic Packaging Technology Conference 2000

2nd Conference

by Electronics Packaging Technology Conference (3rd : 2000 : Singapore)

  • 266 Want to read
  • 3 Currently reading

Published by Ieee .
Written in English

    Subjects:
  • Electronics engineering,
  • Electronics - Microelectronics,
  • Microelectronics,
  • Technology & Engineering,
  • Science/Mathematics

  • The Physical Object
    FormatPaperback
    Number of Pages480
    ID Numbers
    Open LibraryOL11000045M
    ISBN 100780366441
    ISBN 109780780366442

    Author: Andrew A O Tay; Components, Packaging & Manufacturing Technology Society. Singapore Chapter. Publisher: [New York]: Institute of Electrical and Electronics Engineers, © Edition/Format: Print book: Conference publication: EnglishView all editions and formats.   Room Temperature Radiation Testing of a °C Durable 4H-SiC JFET Integrated Circuit Technology: Conference Paper: IEEE Radiation Effects Data Workshop: Journal of Microelectronics and Electronic Packaging, vol. 15, no. 4, pp. ©IMAPS: Electronic Circuits, JFET, High Temperature: Neudeck, Beheim, Salupo.

    C.L. Yeh, Y.S. Lai, C.L. Kao, Evaluation of board-level reliability of electronic packages under consecutive drops, Microelectronics Reliability 46 () [11] R. Darveaux, Effect of Simulation Methodology on Solder Joint Crack Growth Correlation, Electronic Components and Technology Conference, Las Vegas, [12] by: 2. In Proceedings of the Electronic Packaging Technology Conference, EPTC (Vol. January, pp. ). [] Institute of Electrical and Electronics Engineers Inc.. [] Institute of Electrical and Electronics Engineers by: 9.

      Advanced electronic packaging materials play a key role in the proper functioning and useful life of the packaged electronic assembly. These functions mainly include electrical conduction, electrical insulation, mechanical support and structural profiles, environmental protection, as well as thermal conduction and by: 2. Journals & Books; Register Kistner, DBC substrates as a base for power MCM's, Proceedings of 3rd Electronics Packaging Technology Conference (EPTC ) (Cat. NoEX), IEEE, , pp [4] of direct bonded copper (DBC) substrates for power modules. Fifth International Conference on Electronic Packaging Technology Proceedings Cited by: 7.


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Electronic Packaging Technology Conference 2000 by Electronics Packaging Technology Conference (3rd : 2000 : Singapore) Download PDF EPUB FB2

The proceedings of this conference will be available for purchase through Curran Associates. Electronic Packaging Technology (ICEPT), 19th International Conference on.

Print on Demand Purchase at Partner; External Hard-drive Purchase at Partner. Thermal considerations at both the device and the systems level are also Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and -published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products 5/5(2).

The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing.

The proceedings of this conference will be available for purchase through Curran Associates. Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 11th International Conference on. CD-ROM Purchase at Partner; Print on.

Abstract: In this paper, an overview is given of trends in electronic packaging and assembly for portable consumer products. With regard to components, the focus is on thinner and smaller packages with a higher lead count. To save board space, integrated passive components in CSP format are being developed.

The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing. Electronic Packaging Materials and their Properties Article (PDF Available) in IEEE Electrical Insulation Magazine 17(5) - 60 October with 1, Reads How we measure 'reads'.

IEEE 68th Electronic Components and Technology Conference │ San Diego, California │ May 29 – June 1, Power Electronic Packaging, Co -Design and Reliability Yong Liu, Corporate R & D File Size: 6MB.

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

ECTC is sponsored by the IEEE Electronics Packaging Society. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature.

Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety/5(2).

21th International Conference on Electronic Packaging Technology (ICEPT) will be held in Guangzhou in August 12thth, Researchers around the world are welcome to contribute and attend.

The 1st Call for Papers can be downloaded here: The deadline for abstract submission is March 20th Abstracts are solicited to describe. An emerging trend in electronic packaging technology is the “convergent syste m ” or a system that is characte rized by the integration of diverse product functions into one package or product.

Of interest to mechanical and electrical engineers, chemists, physicists, and materials scientists in all areas of the electronic packaging industry, the book takes a unique interdisciplinary approach to the field, allowing specialists in one area to /5(3).

Interconnect Materials in Electronic Packaging Kwang-Lung Lin Student Program, IEEE CPMT. Electronic Components and Technology Conference, PanPacific Microelecronics Symposium Conference, Jan. 3D Packaging 48 source: 3D Packaging, Issue No.

23, May source: 3D Packaging, Issue No. 22, February File Size: 4MB. Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages.

Electronic packaging provides the in-terconnection from the IC to the printed circuit board (PCB). Another function is to provide the desired mechanical andFile Size: 1MB. Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems.

A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can : Ali Jamnia.

The proceedings of this conference will be available for purchase through Curran Associates. Electronic Packaging Technology (ICEPT), 16th International Conference on. Print on Demand Purchase at Partner.

The ultimate, up-to-the-minute electronic packaging resource. Electronic Packaging The ever-increasing pin counts and clock speeds of modern electronics continue to "push the performance envelope" with regard to designing packaging and interconnection solutions that can meet increasingly challenging by: Journal of Electronic Packaging; Journal of Energy Resources Technology; Journal of Engineering and Science in Medical Diagnostics and Therapy; Conference Proceedings.

About ASME Conference Publications and Proceedings; Conference. Mechanics and reliability issues for modern electronic systems are reviewed, and the challenges facing the experimentalist in the packaging field are discussed. Finally, we review the state of the art in measurement technology, with the presentation of selected key applications of experimental solid mechanics to the electronic packaging field.

About the Journal. The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components.

for contributions to electronic packaging and assembly technologies through leadership in Intel Corporation and iNEMI. Robert C. Pfahl, Jr. for developing new manufacturing processes, reducing the environmental impact of electronic manufacturing processes, and fostering collaboration within the manufacturing technology community.Charles A.

Harper is president of Technology Seminars, Inc., Lutherville, Maryland, an organization dedicated to the presentation of educational seminars on electronic packaging and materials.

He has authored over a dozen well-known books in the field and is among the founders and past presidents of the International Microelectronics and Packaging Society.